Changjiang Electronics Technology is the world's leading semiconductor microsystem integration and packaging and testing service provider, providing a full range of microsystem integration one-stop services, including integrated circuit system integration packaging design, technology development, product certification, wafer mid-test, Wafer-level mid-channel packaging and testing, system-level packaging and testing, finished chip testing and direct shipments to semiconductor suppliers around the world.
Through highly integrated wafer-level WLP, 2.5D/3D, system-level (SiP) packaging technology and high-performance Flip Chip and lead interconnect packaging technology, Changdian Technology's products and technologies cover mainstream integrated circuit system applications, including Network communications, mobile terminals, high-performance computing, in-vehicle electronics, big data storage, artificial intelligence and Internet of Things, industrial intelligent manufacturing and other fields. Changjiang Electronics Technology has three major R&D centers and six major integrated circuit production bases in China, South Korea, and Singapore. Marketing offices are located all over the world. They can conduct close technical cooperation with global customers and provide efficient industrial chain support.
