Is the taped patch component the original packaging form?
Time：2021.09.16
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Tape packaging is used before mounting electronic components on the substrate, and this packaging form has become an industry standard. Some people have also asked whether a more environmentally friendly bulk method can be used to supply capacitors and resistors. Now that the taping and packaging method has become the mainstream, is it designed like this at the beginning or is it changed suddenly in the middle? Panasonic's thin radio "Pepper", which used the "Pepper Police Department" of the "Morning Morning Girls Group" as a commercial song, was first launched in 1976. At that time, in order to mount the chip components on the substrate, a container (loader) called a "tray" was used. As a method of mounting a large number of small parts on the substrate, it has an epoch-making breakthrough. Prior to this, the placement of patch components was mainly performed by human tweezers, and it was not used for civilian products that required a large amount of placement. (Components with leads are automatically mounted.) Since the tape was designed in 1978 until it became the mainstream, the packaging form of chip components can be called the "tray era". The new components used in "Pepper" have a size of 3.2×1.6mm and are stacked vertically in a plastic tray (tray) in units of 200. The length of the tray is 135mm, and the width is similar to that of a mechanical pencil. If you don't plug the ends, it will fall out. When shipping to customers, it is necessary to install plugs (plugs) on the upper and lower parts of the tray. When the customer is in use, according to the overall size of the tray (5.0×3.5mm or 4.5×4.5mm, etc.), the tray is inserted into the matrix-shaped grid, and then the tray is placed in the specified position of the substrate positioning grid. This job looks a lot like "planting rice seedlings". ] Pull off the plug on one side (upper), and use a spring-loaded rod to push the component out of the tray from below. The substrate is placed above the tray, and the bonding pad has been coated with adhesive. The component position of the substrate is limited by the position of the sash, and the sash is determined by the outer dimensions of the tray. Even so, dozens or even hundreds of components can be mounted on the substrate at a time. This operation method is very efficient and suitable for mass production. But on the other hand, there are also some problems, such as the restriction of the component position, the necessary tool card molds for each substrate, and the type switching. Therefore, people have been exploring higher-degree-of-freedom operation methods and packaging forms. The invention of the braid is a result obtained in the process of exploration. It is made by leaving a cavity (cavity) on the braid and separately packaging the components. The method of picking up components by suction nozzles and freely mounting them to any position on the substrate has been accepted by most customers, and has been developed and maintained to the present. In fact, this is already 30 years ago.
